P/N 1111841-X 0.5mm 8- and 10-Pin MSOP-to-0.300" DIP Adapter
FEATURES * A cost-effective means of upgrading to MSOP 0.5mm package SOIC without changing your PCB layout. * Available on 0.300 [7.62] centers. GENERAL SPECIFICATIONS * BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides * PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M * PIN PLATING: 200 [5.08] Sn/Pb 93/7 per ASTM B579-73 over 100 [2.54] Ni per SAE AMS-QQ-N-290 * OPERATING TEMPERATURE: 221F [105C] MOUNTING CONSIDERATIONS CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. * SUGGESTED PCB HOLE SIZE: 0.028 0.003 [0.71 0.08] dia.
Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice.
ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: 0.005 [0.13] UNLESS OTHERWISE SPECIFIED CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
ORDERING INFORMATION
1111841-8 = 8-Pin 1111841-8-P = Panelized Version
Bristol, PA 19007-6810 USA TEL (215) 781-9956 * FAX (215) 781-9845 WWW.ARIESELEC.COM * INFO@ARIESELEC.COM
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18067 Rev. AA
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